■　Achieving ±3µm @ 3 XY placement & ±0.1⁰ @ 3 die rotation with patented look-through pattern recognition

■　Flip chip handling capability

■　Large substrate handling - up to 8" x 8"

■　Diverse material handling

– Standard: Wafer on expander or clamp ring

–Optional: Waffle pack, Gelpak, tray, tape feeder or by request

■　Optional features to enhance bonding accuracy

– Precise bond force control with bond force sensor

–Snap UV curing to enhance high precision bonding performance

– Snap UV curing to enhance high precision bonding performance Support both spot curing & panel curing (Substrate size dependent)

–Eg. Lens attach for PCB/COB transceiver packages